DeSCRJPTion / Comment
● Preferred stock type ○ Lead time > 6 weeks  X Not for new development

Max. Voltage
[kV]

Peak Current
[A]

Peak Power
[MW]

On-   Time
[μs]

Housing Dimensions
[mm³]

4

10000

40

35…∞

89 x 64 x 31

6

10000

60

35…∞

122 x 64 x 31

6.4

1000

6.4

35…∞

135 x 20 x 20

6.4

2000

12.8

35…∞

80 x 38 x 25

8

2000

16

35…∞

89 x 64 x 31

8

5000

40

35…∞

89 x 64 x 31

8

10000

80

35…∞

153 x 64 x 31

10

16000

160

35…∞

179 x 103 x 35

12

2000

24

35…∞

122 x 64 x 31

12

5000

60

35…∞

122 x 64 x 31

12

16000

192

35…∞

204 x 103 x 35

12.8

1000

12.8

35…∞

80 x 38 x 25

15

2000

30

35…∞

103 x 70 x 35

16

2000

32

35…∞

89 x 64 x 31

16

5000

80

35…∞

153 x 64 x 31

16

2000

32

35…∞

153 x 64 x 31

16

16000

256

35…∞

253 x 103 x 35

20

8000

160

35…∞

179 x 103 x 35

22

8000

176

35…∞

179 x 103 x 35

22

10000

220

35…∞

252 x 150 x 40

22

12000

264

35…∞

160 x 150 x 30

24

1000

24

35…∞

103 x 70 x 35

24

8000

192

35…∞

204 x 103 x 35

24

10000

240

35…∞

252 x 150 x 40

24

12000

288

35…∞

160 x 150 x 30

30

1000

30

35…∞

103 x 70 x 35

32

2000

64

35…∞

153 x 64 x 31

32

8000

256

35…∞

253 x 103 x 35

32

2000

64

35…∞

206 x 70 x 35

40

2000

80

35…∞

312 x 120 x 38

44

12000

528

35…∞

312 x 200 x 45

60

2000

120

35…∞

372 x 120 x 50

64

1000

64

35…∞

206 x 70 x 35

80

1000

80

35…∞

312 x 120 x 38

120

1000

120

35…∞

372 x 120 x 50

120

24000

2880

35…∞

672 x 400 x 68

Options (1)

HFB

High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.

HFS

High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded.(2)

LP

Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring in high speed applications. (3)

ST

Stage Tapping: Connectors at the individual stages of stack in order to utilie single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).

ISO-25

25 kV Isolation: Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.

ISO-40

40 kV Isolation: Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

ISO-80

80 kV Isolation: Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

ISO-120

120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

I-PC

Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers).(2)

I-FWD

Integrated Free-Whee Diode: Built-in parallel diode with short recovery time. In connection with inductive load only.

LS-C

LEMO socket for Control Connection: Input =100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3)

PT-C

Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-Modu plug. Only for switches with pins, which must be replaced by pigtails in case of any coo option except option ITC.

PIN-C

Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.

PT-HV

Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.

ST-HV

Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.

SEP-C

Separated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.

FOI-C

FOO-F

UL94

Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)

TH

Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)

FC

Flat Case: Height of standard plastic housings reduced to 19 / 25 mm. Not in combination with coo options CF, GCF and DLC.

ITC

Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)

CF

Copper Coo Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air coo with forced or natural convection as well as for liquid coo with non-conductive coolants.

CF-1

Copper Coo Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid coo (e.g. Galden® or oil).

CF-X2

Copper Coo Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant coo power improvement in connection with forced air or liquid coo.

CF-X3

Copper Coo Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant coo power improvement in connection with forced air or liquid coo.

CF-CS

Copper Coo Fins with customied shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased coo power.

CF-LC

Copper Coo Fins for liquid coo: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S.

Double Copper Coo Fins: Approx. 100% more coo power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS.

Copper Coo Fins: Semiconductors soldered on fins. Approx. 30% to 100% more coo power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS.

CF-GRA

Non-isolated Coo Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm.

CF-CER

Isolated Coo Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.

CCS

Ceramic Coo Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.

CCF

Ceramic Coo Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.

C-DR

Coo for Driver: Extra coo for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)

GCF

Grounded Coo Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coup capacitance. In combination with option SPT-C only.

GCF-X2

Grounded Coo Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance “Switch to Flange” reduced for twice the power capability. (2)

ILC

Indirect Liquid Coo: Liquid coo for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.

DLC

Direct Liquid Coo: Internal coo channels arround the power semiconductors. The most efficient coo for high frequency applications. Non-conductive coolants only.

HI-REL

High Reliability / MIL Versions: Available on request. (2)